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Nano-scale discovery could help to cool down overheating in electronics

Photo by: Phys.org

A team of physicists at CU Boulder has solved the mystery behind a perplexing phenomenon in the nano realm: why some ultra-small heat sources cool down faster if you pack them closer together. The findings, published today in the journal Proceedings of the National Academy of Sciences (PNAS), could one day help the tech industry design faster electronic devices that overheat less.

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